NANOIDENT delivers world's largest printed semiconductor-based photodetector array for industrial, medical and security applications

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NANOIDENT Technologies AG, the world leader in printed semiconductor-based optoelectronic sensors, today announced that it has delivered the world's largest printed semiconductor-based photo detector array on a flexible PET foil substrate. An industry first, this array was developed with the NANOIDENT SEMICONDUCTOR 2.0™ Platform and manufactured at the NANOIDENT ORGANIC FAB (OFAB). With NANOIDENT technology, OEM partners can now realize application-specific, cost-effective, printed semiconductor-based photo detector arrays that eliminate the need for costly optical filters and can be used in a wide variety of new industrial, medical and security applications.

The NANOIDENT SEMICONDUCTOR 2.0 Platform serves as the core technology foundation for a wide array of application-specific printed semiconductor platforms and products. With its platform, NANOIDENT was able to manufacture a large-area photo detector array device that converts light into electrical signals by depositing thin layers of conducting and semiconducting inks onto a plastic foil substrate using state-of-the-art printing techniques. By using printed semiconductor based technology which enables unique mechanical, electro-optical and structural properties the company was able to deliver an array 18x12cm in size, and could easily produce detectors up to 50x50cm or larger. With large-area, ultra-thin, flexible devices that incorporate application specific spectral properties, customers are able to eliminate expensive optical filters and develop an entirely new class of application types. Sample applications for large-area photo detector arrays include industrial measurement and test, medical imaging and security screening.

One of our industrial customers came to NANOIDENT requesting a radical new photo detector array design for a specific industrial application that could not be delivered with silicon,� said Klaus Schroeter, CEO for NANOIDENT. Working together, we were able to deliver the industry's first large-area array on a flexible substrate that includes specific spectral sensitivity and meets other application-specific requirements. We are excited to deliver this solution, which will transform existing test processes as well as create an entirely new application for the industrial market.

NANOIDENT's SEMICONDUCTOR 2.0 Platform is the core technology for all NANOIDENT vertical market platforms and is comprised of four core intellectual property (IP) elements, which include liquid conductive and semi-conductive materials IP, design and simulation IP, production processes and quality assurance IP, and functional component IP. The SEMICONDUCTOR 2.0 Platform enables the design and mass production of printed semiconductor based functional components, such as photo detectors, light emitting diodes, transistors, resistors, capacitors and interconnects. With NANOIDENT's new printed semiconductor production process devices can also be manufactured in hours rather than weeks.

Availability
Printed semiconductor devices based on NANOIDENT's SEMICONDUCTOR 2.0 Platform are highly customized and sold directly to global OEM partners. For more information about NANOIDENT and the SEMICONDUCTOR 2.0 Platform, please visit http://www.nanoident.com .

About NANOIDENT Technologies AG
NANOIDENT is the world leader in the development and manufacture of printed semiconductor based opto-electronic sensors. The company's core technology merges the latest breakthroughs in materials science and nanotechnology with modern printing techniques to create a new class of semiconductor devices. The revolutionary SEMICONDUCTOR 2.0 Platform is the basis of the world's first commercial printed photonic sensors, enabling a whole new generation of applications in the industrial, biometric and life science markets.
NANOIDENT's high speed, environmentally friendly manufacturing process utilizes liquid nanomaterials and additive production techniques. These liquids are used to print electronic circuits on a wide variety of surfaces, producing products in mere hours for prototype as well as high volume applications. The company's printed semiconductor devices can be bendable, disposable, light, ultra thin and large area. They have application specific spectral and electronic properties, and can contain light sources and light detectors as well as electronic circuits. These unique characteristics enable cost effective, custom designed devices for applications such as industrial, chemical, biological, biometric and X-ray sensors, printed OLED displays for smart packaging and electronic signage.
Privately-held, the company is headquartered in Linz, Austria, with subsidiaries in Menlo Park, California, Nuernberg, Germany, and Grenoble, France.